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CALL FOR PAPERS

INTERCON 2023 – XXX International Conference on Electronics, Electrical Engineering and Computing 

November 02 - 04, 2023

UPC, Lima, Peru

http://intercon.org.pe 

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IMPORTANT DATES

Paper submission: July 31,  2023

Notification: September 15, 2023

Camera-ready: October 05, 2023

Author registration deadline: October 12, 2023

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The XXX International Conference on Electronics, Electrical Engineering and Computing - INTERCON 2023 is a prestigious international technical conference organized by the IEEE Peru Section to bring together technological applications, knowledge, and understanding. INTERCON 2023 is the XXX version of the conference and is themed around the IEEE Future Directions platforms. The venue  of the 2023 edition of INTERCON is  UPC (Universidad de Ciencias Aplicadas) and its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 aims to continue the legacy of its predecessors by serving as a great platform for researchers to discuss and explore advanced technologies that can advance humanity.

TOPICS OF INTEREST

Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:

• T1. Artificial Intelligence and Machine learning
• T2. Communications and Networking
• T3. Power, Energy, and Power Electronics
• T4. Biomedical Engineering and Healthcare Technologies 
• T5. Robotics, Control, Instrumentation, and Automation 
• T6. Multimedia Signal Processing and Analytics
• T7. Devices, Circuits, and Materials
• T8. RF Circuits, Systems, and Antennas
• T9. Data Science and Computing Technologies
• T10. Education in Engineering and Technology

SUBMISSION GUIDELINES

The conference invites research papers of varying length from 6 to 8 pages  (including abstract and references) and written in English. The format of the papers is based on IEEE conference template, which can be downloaded from:

https://www.ieee.org/conferences/publishing/templates.html

For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore digital library. All papers, only in PDF file, must be submitted electronically through the EasyChair:

https://easychair.org/conferences/?conf=2023ieeeintercon

ORGANIZING COMMITTEE

ADVISORY COMMITTEE

• Carlos Silva Cardenas.
• Ernesto Cuadros Vargas
• William Ipanaqué Alama.

GENERAL CHAIR 

• César A. Beltrán Castañón

GENERAL CO-CHAIRS

• Yván Tupac Valdivia 

FINANCE CHAIR

• Jimmy Túllume Salazar 

PUBLICATION CHAIRS

• Pedro Shiguihara 
• José Durán Talledo 

LOCAL CO-CHAIR

• Carlos Valdez (UPC, Peru)
• Nikolai Vinces (UPC, Peru)
• Yohanna Villanueva (UPC, Peru)

CONFERENCE CONTACT

• Marleni Delgado  (administracion@ieee.org.pe)