ICICM is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

The previous 9 editions ICICM have been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020 and Oct 22-24, 2021, as well as October 28-31 in 2022, Oct 20-23 in 2023, in Wuhan on Oct 25-27. On the basis of success of the previous 9 year, ICICM comes to its 10th edition, herewith, we are proud to announce 2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) will be held in Hefei, China on October 17-19, 2025, which is co-sponsored by Anhui University, China; Southeast University, China and University of Electronic Science and Technology of China.

Submission Guidelines

Preparation of the Manuscript

1. All manuscripts must be written in English.

2. The minimum page limit for all manuscripts is 4 full pages, and the maximum page limit is 10 pages. When it exceeds 6 pages, each additional page will be chargeable. These limits include all figures, tables, and references. All manuscripts must be formatted in conference proceedings – Letter paper size, two columns format.

3. Manuscripts should state clearly and concisely the problem, methodology used and central conclusions, and may include figures and graphs.

4. Manuscripts must include a bibliography to help reviewers place the contributions of the work into context.

List of Topics

• (related to the below topics, but not only limited)
• • Progress of EDA algorithms
• • EDA for emerging technologies
• • Hardware-software co-design with EDA
• • EDA in High Performance Computing (HPC)
• • EDA in analog and mixed-signal design
• • Security and reliability in EDA
• • Open Source EDA Initiative
• • EDA and Internet of Things (IoT)
• • EDA for FPGA and ASIC design
• • EDA in the automotive industry
• ...etc

Keynote Speakers

• Speaker 1 Prof. Xiaoqing Wen, IEEE Fellow, Kyushu Institute of Technology, Japan
• Speaker 2 Prof. Kaixue Ma, CIE Fellow, Tianjin University, China
• Speaker 3 Assoc. Prof. Yongqiang Lyu, Tsinghua University, China

Publication

Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the conference proceedings, and indexed by EI Compendex and Scopus, etc.

Venue

Anhui University

Contact

Secretary: Ms. Mila Xiao

Email: icicm_conf@vip.163.com