The 2026 IEEE XXXIII International Conference on Electronics, Electrical Engineering and Computing (INTERCON) aims to bring together researchers, professionals, students, and entrepreneurs to foster collaboration, address global challenges, and promote the development of technologies that benefit humanity. INTERCON is a prestigious IEEE technical conference organized by the IEEE Peru Section and is recognized for its commitment to innovation and excellence in engineering and computing.

The 2026 edition will be held in person in Trujillo, Peru, and will be co-organized by Universidad Privada Antenor Orrego (UPAO) and its IEEE UPAO Student Branch. This year’s theme is inspired by the IEEE Future Directions platforms, with a focus on transformative and emerging technologies. We invite you to submit your technical papers for oral, on-site presentations. INTERCON 2026 will continue its tradition of offering a dynamic platform for knowledge exchange, research dissemination, and collaboration among academia, industry, and innovators, further advancing IEEE’s mission to foster technology for the benefit of humanity.

Important Dates

• Full Paper Submission Deadline (Last Call): June 29
• Notification of Acceptance: July 6
• Camera-Ready Submission: July 20
• Author Registration Deadline: July 20
• Oral Presentations: August 12–14

Submission Guidelines

• The offcial language of INTERCON 2026 is ENGLISH. The maximum number of authors per paper, including co-authors, is six (6). Papers must be submitted in PDF format and be between six (6) and eight (8) pages long, following the https://www.ieee.org/conferences/publishing/templates
• We will use EasyChair system for submissions here: EASY CHAIR
• Accepted papers must be presented on-site to be eligible for submission to the IEEE Xplore Digital Library.

List of Topics

• T1. Artificial Intelligence and Machine Learning
• T2. Communications and Networking
• T3. Power, Energy, and Power Electronics
• T4. Biomedical Engineering & Healthcare Technologies
• T5. Robotics, Control, Instrumentation, and Automation
• T6. Multimedia Signal Proccesing and Analytics
• T7. Devices, Circuits, and Materials
• T8. Data Science and Computing Technologies
• T9. Education in Engineering and Technology
• T10. Innovation, Management, and Smart Production

Committees

Organizaing Committee of IEEE Peru Section

• Conference Chair - Dr. Carlos Raymundo Ibañez
• Conference Treasurer - Msc. Gianpierre Zapata Ramirez
• Technical Program Chair - Dr. Guillermo Kemper Vásquez
• Publication Chair - Msc. Jorge Heyul Chavez Arias

Organizaing Committee of UPAO

• Dean of the Faculty of Engineering UPAO – Dr. Ángel Alanoca Quenta
• Director of the School of Computer and Systems Engineering – MSc. Vladimir Urrelo Huiman
• Director of the Electronics Engineering Program – MSc. Filiberto Azabache Fernández
• Director of the Industrial Engineering Program – MSc. Muller Solon
• Director of the Civil Engineering Program – Dr. Ricardo Narvaez Aranda
• IEEE UPAO Student Branch President – Valerie Solange Eileen Quispe Malca
• IEEE UPAO Student Branch Vice President – Diego Dustin Herrera Rosas
• IEEE UPAO Student Branch Treasurer – Stephany Nicole Obeso Schaus
• IEEE UPAO Student Branch Secretary – Daniel Isaac Quito Horna
• IEEE UPAO Student Branch Advisor – Luis Vargas Díaz

Venue

The conference will be held in person at Universidad Privada Antenor Orrego (UPAO), in the city of Trujillo, Peru.

International participants with travel-related constraints may contact the organizing committee by email in advance to coordinate suitable participation arrangements.

Contact