AUSTROCHIP 2026: 34th Austrian Workshop on Microelectronics University of Applied Sciences Technikum Wien; Höchstädtplatz 6, 1200 Wien, Austria Vienna, Austria, October 23, 2026 |
| Conference web page | https://embsys.technikum-wien.at/austrochip2026/ |
| Submission link | https://easychair.org/conferences/?conf=ac2026 |
| Submission deadline | August 3, 2026 |
Austrochip is an annual meeting and platform to present the latest activities in the field of microelectronics and integrated circuits in Austria and neighboring countries. The workshop is a forum for discussion and contact between academia and industry. Austrochip 2026 is the 34th edition organized by the by the Research Group Embedded Systems, FH Technikum Wien. Austrochip 2026 receives gracious support by our Sponsors.
Submission Guidelines
- Format has to be in A4 format according to the IEEE style.
- Anonymous - remove authors, institutions, and the acknowledgment as papers will be double-blind reviewed.
- Papers shall be in the range of 4-8 pages (including bibliography and appendix).
- Papers should be written in English and submitted in PDF file format to be published in IEEE Xplore.
- Original, unpublished, and not simultaneously submitted to other workshops, conferences, or journals.
Original, unpublished, and not simultaneously submitted to other workshops, conferences, or journals.
Austrochip 2026 reserves the right to exclude any accepted paper from distribution after the conference (including removal from IEEE Xplore) if the accepted paper is not presented at the conference.
IEEE owns the copyright to the technical contributions it publishes. In this case, the authors must comply with the IEEE copyright policy, and a signature on an IEEE Copyright Form is required for the final submission. This form will be provided after the acceptance notification
List of Topics
Submissions of original research papers to the workshop should cover, but are not limited to, the following topics listed below.
- Analog, mixed-signal, and RF integrated circuits
- Digital circuits, filters, DSPs, asynchronous designs
- FPGA design and reconfigurable hardware
- Design methodology, system-level design, giga-scale circuits, network-on-chip
- Embedded systems & IoT, energy-efficient machine learning, low-power designs, RF systems, security aspects, AI on embedded systems
- Verification and testing, signal integrity, device modeling, timing analysis, reliability simulation, EMC, ESD
- Emerging technologies, quantum computing, nano CMOS process, sub-threshold circuits, sensors, organic and biomedical electronics
- Case studies and prototyping
Submissions from academia and industry are encouraged.
PhD students are especially invited to present their research on Austrochip-related topics, and excellent MSc theses will also be considered.
Committees
Program Committee
- Bernd Deutschmann (TU Graz)
- Michael Hutter (University of the Bundeswehr Munich)
- Nikolaus Kerö (Oregano Systems)
- Michael Lunglmayr (JKU Linz)
- Alicja Michalowska-Forsyth (TU Graz)
- Timm Ostermann (JKU Linz)
- Peter Rössler (FH Technikum Wien)
- Stefan Schmickl (Infineon)
- Philipp Sommeregger (FH Kaernten)
- Peter Söser (TU Graz)
- Andres Springer (JKU Linz)
- Andreas Steininger (TU Wien)
- Johannes Sturm (FH Kaernten)
- Johannes Wolkerstorfer (xFace Graz)
Organizing Committee
- Martin Horauer (General Chair)
- Christian Fibich (Program Co-Chair)
- Thomas Polzer (Publication Co-Chair)
- Peter Rössler (Publicity Co-Chair)
- Patrick Schmitt (Financial Co-Chair)
- Roman Beneder (Organisational Co-Chair)
Publication
All submissions will be double-blind reviewed and have to fulfill the requirements of IEEE Xplore. It is intended that the papers accepted by the program committee will be made available in electronic form at the conference and submitted to IEEE Xplore.
The papers will then be indexed by well-known major indexing services like DBLP, ACM, Google, etc. (for details see a list of IEEE indexing agreements here). Submission implies that at least one of the authors registers and presents the paper at the conference.
Venue
Austrochip 2026 is located in the Main Campus Höchstädtplatz at the University of Applied Sciences Technikum Wien.
Address
Höchstädtplatz 6
1200 Wien
F-Building, Room F0.01 on ground level next to the main entrance
Public Transport
- Subway: U6 - Station Dresdner Straße
- Tram: Lines 2, 31, and 33 - Station Höchstädtplatz
NOTE: There will be no train services to the closest stations Traisengasse and Handelskai in fall of 2026.
By Car
The 20th district is a short-term parking zone from Monday to Friday between 9 am and 10 pm. Recommended parking is available in the garage BC 20 (Dresdner Str. 43-47).
Contact
All questions about submissions should be emailed to martin.horauer@technikum-wien.at |
