Download PDFOpen PDF in browserNumerical Analysis on Thermal Conductivity of Vapor Chamber Using an Iterative Approach10 pages•Published: August 5, 2017AbstractTechnological developments have resulted in a growing demand for high power electronic devices. Although these high power devices meet the high performance requirements, they also generate a very large amount of heat which adversely affects their operating efficiency. Most part of the heat within a package is generated at the chip and hence it is important to keep junction temperature as low as possible. This is commonly achieved by using heat sinks mounted directly on top of the package. Using a vapor chamber can reduce thermal resistance by better spreading heat across the heat sink base. This work presents a parametric study of vapor chambers as heat spreaders and discusses the merits of using this technology especially in high power devices through CFD modeling. Iterative method is used to finalize the value of Ks and Kl by considering the orthotropic approach.Keyphrases: isotropic approach, iterative method, thermal conductivity, vapor chamber In: Ajitkumar Shukla, J. M. Patel, P. D. Solanki, K. B. Judal, R. K. Shukla, R. A. Thakkar, N. P. Gajjar, N. J. Kothari, Sukanta Saha, S. K. Joshi, Sanjay R. Joshi, Pranav Darji, Sanjay Dambhare, Bhupendra R. Parekh, P. M. George, Amit M. Trivedi, T. D. Pawar, Mehul B. Shah, Vinay J. Patel, Mehfuza S. Holia, Rashesh P. Mehta, Jagdish M. Rathod, Bhargav C. Goradiya and Dharita K. Patel (editors). ICRISET2017. International Conference on Research and Innovations in Science, Engineering and Technology. Selected Papers in Engineering, vol 1, pages 316-325.
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