Reduction of Temperature in Layered Structure of Transceiver by Heat Conduction Through Thermal Simulations

EasyChair Preprint 8647

Abstract

Transceivers consist of electronic and photonic components based on silicon-on-insulator (SOI) technology. During its operation, the device gets heated up due to temperature sensitivity of photonics components, and the temperature of the device increases. This increases the temperature to heat power supplied to the layered structure of laser, electronic drivers, and trans-impedance amplifiers (TIAs). To keep the device cool, heat must be transferred from source to sink at a faster rate. Using conduction of heat through thermal simulation heat is transferred from source to sink. The temperature per heat power supplied to the laser decreases from 2.0 K /mW to 1.7 K/ mW by decreasing the thickness of the thermal interface material (TIM).

Keyphrases: Temperature reduction in Transceiver, Thermal simulations for transceiver, Thermal simulations using Solidworks, optics, silicon photonics, temperature reduction in Electro-optic device

@booklet{EasyChair:8647,
  author    = {Muzammal Amin and Muhammad Atif and Abdul Latif},
  title     = {Reduction of Temperature in Layered Structure of Transceiver by Heat Conduction Through Thermal Simulations},
  howpublished = {EasyChair Preprint 8647},
  year      = {EasyChair, 2022}}